Product line CategoryAI DSP , Baseband IC/ SOC , Bluetooth IC , Chipset , Communication Protocols , CPU , Display/ Video Solutions , GSM/GPRS Module , LCD Driver IC , LTE Module , Multimedia , NB-IoT Module , Processor Products , STB , WiFi Module , WiFi Solution , WLAN , WLAN + Bluetooth Module , WLAN Module
Product line ApplicationAutomotive , Computer , Industrial , Consumer , Communication , IoT
HiSilicon Technologies Co., Ltd. was established in October 2004. Her former, ASIC Design Center of Huawei Technologies, was founded in 1991. With her headquarter in Shenzhen of China, Hisilicon has set up design divisions in Beijing, Shanghai, Silicon Valley (USA) and Sweden.
HiSilicon provides ASICs and solutions for communication network and digital media. These ASICs are widely used in over 100 countries and regions around the world. In the digital media field, Hisilicon has already released the SoC and solution for network surveillance, videophone, DVB and IPTV.
After years' accumulation, Hisilicon has mastered the leading IC design and test technologies, constructed the advanced EDA design platform, as well as R&D flow and regulations. Moreover, Hisilicon possesses the IPRs of more than 100 types of self-developed chips, at the same time owns over 500 patents.
Hisilicon has kept excellent strategic cooperation with partners from USA, Japan, Europe and China, thus maintain a complete and stable network covering wafer production, encapsulation and test.
During 17 years' development, meeting customers' demands are driving force for Hisilicon. She always aims to provide high quality chip solutions with good services and quick response to customers' request. HiSilicon Technologies will persist in value creation for customers continuously.
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