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世平集團推出RockChip,Elan,TI 之Android系統機上盒方案

 2013-01-23

機頂盒產業從2010 年起,進入市場調整和深入發展的又一個行業景氣週期,中國製造的機頂盒總出貨量保持穩定增長,與此同時,高清機頂盒迎來發展期,尤其是中國三網融合的提速,更加推進了機頂盒產業的發展。

 

世平集團特推出方案如下:

  • Rockchip RK3066機頂盒方案
  • Elan Touch Remote Control Unit
  • TI SmartRC(智慧遙控器)

 

一、Rockchip RK3066機頂盒方案

RK3066 Key Feature:

  • 40nm low power process
  • Dual ARM Cortex-A9 processor, up to 1.4GHz
  • Mali-400MP4 Quad-core GPU, support OPENGL ES 1.1/2.0 , OPENVG 1.1, OPENCL
  • Full memory support, DDR3, DDR3L, LPDDR2
  • High performance dedicated 2D processor
  • 1080P multi format video decoding, include WebM
  • 1080P video encoding for WebM & H.264
  • Stereoscopic 3D H.264 MVC video Codec
  • Embed HDMI 1.4a, support 3D display
  • Embed 60bits ECC, support MLC NAND, E-MMC, i-NAND and booting
  • Dual panel display and dual camera supported
  • Rich peripheral and connectivity

  

方案框圖:

WPIg_STB_diagram

 

WPIg_Rockchip_STB_diagram

方案照片:

WPIg_Rockchip_STB_photo 

 

二、Elan Touch Remote Control Unit

ELAN Remote Control HWR Solution

WPIg_Elan_STB_Diagram

  

Key Parts

WPIg_Elan_STB_introduction

 

 EVM 照片

WPIg_Elan_STB_photo

 

三、TI SmartRC(智能遥控器)

 WPIg_TI_STB_solution1

 

 

WPIg_STB_solution2

 

 

WPIg_TI_STB_solution3

 

WPIg_TI_SmartRC_photo