新聞中心

富威推出Invensense 智慧型手機OIS模組解決方案

 2014-09-03

【方案介紹】
Invensense IDG-2030(U)為兩軸陀螺儀組件,專為智慧型手機OIS模組設計,提供防手震並增加照片清晰程度。
手機相機模組已成為今日掌上型產品的基本功能之一。這些模組,已演變到超越5 Mega Pixel(MP)的高解析度與高影像品質。觀看最近的市場趨勢,智慧型手機製造商正採用超過8 MP與具高解析度的手機相機模組。對高解析度的青睞,延伸出市場對光學防手抖功能的需求,以防止低光線下的手抖(hand jitter)與各種光線下的攝影抖動(video jitter)所導致影像扭曲的現象產生。相機模組整合與促動器技術(actuator technology)的發達,搭配InvenSense小尺寸、高效能的陀螺儀,讓掌上型相機模組能夠直接擁有OIS功能,提供不輸DSC的影像品質。

 

富威代理產線InvenSense的新一代OIS專用二軸陀螺儀,是專門為了滿足智慧型手機市場對相機的需求設計的。IDG-2030(U)為OIS新一代二軸陀螺儀產品,為目前市場的最小尺寸(2.3*2.3*0.65),可整合至最薄、最緊湊的模組中,並支援超音波水洗, 大大提高模組廠良率, 是最適合整合至下一代更薄之智慧型手機內的產品。InvenSense單一結構陀螺儀設計,含單一驅動頻率(single drive frequency)、高敏感度、高軸間隔絕、低相位延遲、低雜訊、迅速的20MHz SPI介面,使Invensense的解決方案,可滿足目前與下一代智慧型手機相機模組對OIS的需求。

 

【產品應用】
• Optical Image Stabilization for Digital Still Camera and Video Cameras
• Electronic Image Stabilization for video jitter compensation

 

【產品特性】
2.1 Sensors
• Monolithic angular rate sensor (gyros) integrated circuit
• Available in XY (IDG-2030) versions.
• Digital-output temperature sensor
• External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
• Factory calibrated scale factor
• High cross-axis isolation via proprietary MEMS design
• 10,000g shock tolerant

 

2.2 Digital Output
• Fast Mode (400kHz) I2C serial interface
• 1 MHz SPI serial interface for full read/write capability
• 20 MHz SPI to read gyro sensor & temp sensor data.
• 16-bit ADCs for digitizing sensor outputs
• User-programmable full-scale-range of ±31.25°/sec, ±62.5°/sec, ±125°/sec and ±250°/sec

 

2.3 Data Processing
• The total data set obtained by the device includes gyroscope data, temperature data, and the one bit external sync signal connected to the FSYNC pin.
• FIFO allows burst read, reduces serial bus traffic and saves power on the system processor.
• FIFO can be accessed through both I2C and SPI interfaces.
• Programmable interrupt
• Programmable low-pass filters

 

2.4 Clocking
• On-chip timing generator clock frequency ±1% drift over full temperature range

 

2.5 Power
• VDD supply voltage range of 1.71V to 3.6V
• Flexible VDDIO reference voltage allows for multiple I2C and SPI interface voltage levels
• Power consumption for two axes active: 2.9mA
• Sleep mode: 5μA
• Each axis can be individually powered down

 

2.6 Package
• 2.3x2.3x0.65mm footprint and maximum thickness 16-pin QFN plastic package
• MEMS structure hermetically sealed at wafer level
• RoHS and Green compliant

 

【產品方塊圖】

 

更多代理產線資訊歡迎前往富威網站: http://www.rich-power.com.tw