Fairchild Introduces Industry Smallest DrMOS FET Plus Driver Multi-Chip Module for Synchronous Buck Converters
Fairchild Semiconductor (NYSE: FCS) announces the FDMF6700, a fully optimized and integrated FET plus driver power stage solution in an ultra-compact 6mm x 6mm MLP package and saves more than 80 percent board space compared to conventional discrete solution.
A typical buck converter in a PC motherboard may include, per phase: three N-channel MOSFETs in a DPAK package and one driver IC in SO8 package. By replacing these components with the new highly integrated FDMF6700, designers save more than 80 percent of valuable board space.
In addition, through the integration of components into an optimized single-package solution, parasitic inductances of board traces and leads of the individual discrete packages are eliminated, improving overall efficiency.
“Our FDMF6700 in the 6mm x 6mm MLP package is 44 percent smaller than any other DrMOS device available in the market today,” says Roberto Guerrero, world wide segment manager for Desktop, Server and Gaming Products in Fairchild’s Functional Power Group. “This new solution places Fairchild as the leader in ultra-high-density DrMOS technology.”
Fairchild Semiconductor offers the broadest portfolio of DrMOS FET plus driver multi-chip modules today. This family includes:
This comprehensive DrMOS portfolio offers designers the option to choose the right performance point at the right price for the right application.
The FDMF6700 is available in a 40-pin (6mm x 6mm) MLP. These products utilize lead-free (Pb-free) terminals and have been characterized for moisture sensitivity in accordance with the Pb-free reflow requirements of the joint IPC/JEDEC standard J-STD-020. All Fairchild products are designed to meet the requirements of the European Union Directive on the restriction of the use of (certain) hazardous substances (RoHS).