热点频道

EMMC 04GB~64GB

 2015-12-04

【产品特性】

• eMMC™ 5.0 interface
• Compliant with eMMC™ Specification Ver.4.4, 4.41,4.5&5+D13.0
• NAND Density & Attribute: 4GB - 64GB、MLC (2 bit/cell) / TLC (3 bit/cell)
• Package size 153 ball FBGA (11.5 x 13.0 x 1.0mm) for 4GB~32GB
(Note: 64GB package size is 11.5 x 13.0 x 1.4mm)
• Bus mode
- High-speed eMMC™ protocol
- Provide variable clock frequencies of 0-200MHz.
- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
• Operating voltage range :
- VCCQ = 1.8 V/3.3 V
- VCC = 3.3 V
• Quality - RoHS compliant
• Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits
- Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)
- Single data rate : up to 200Mbyte/s @ 200MHz
- Dual data rate : up to 104Mbyte/s @ 52MHz
(Note:64GBDual data rate could up to 400Mbytes/s@200MHz )
• Error free memory access
- Internal error correction code (ECC) to protect data communication
- Internal enhanced data management algorithm
- Solid protection of sudden power failure safe-update operations for data content
• Support secure bad block erase commands & Enhanced write Protection with permanent and partial protection options
• Supports (Alternate) Boot Operation Mode to provide a simple boot sequence method
• Supports SLEEP/AWAKE (CMD5).
• Host initiated explicit sleep mode for power saving
• Enhanced Write Protection with Permanent and Partial protection options
• Supports Multiple User Data Partition with Enhanced User Data Area options、Background Operations & High Priority Interrupt (HPI)、 Enhanced storage、Field Firmware Update(FFU)、Production State Awareness 、Power Off Notification for Sleep

【产品应用】

eMMC产品主要应用于智能型手机、平板计算机等移动设备产品,也用在数字相机、录音机、MP3/MP4播放器、电子学习产品、智能电视、电视棒、机顶盒,甚至车载装置、如GPS卫星导航、车用多媒体设备的理想储存解决替代方案。

【文字介绍】

Kingston推出的嵌入式产品与市场上主流的eMMC产品一样,将NAND Flash和Controller封装在一起,简化了应用程序的界面设计,缩短产品推向市厂的生产周期。
金士顿eMMC采用A19nm MLC NAND Flash,符合JEDEC eMMC 5.0规范标准,Kingston eMMC MLC容量从4GB-32GB,所有的产品皆为Pin to Pin,而且尺寸大小皆为11.5x13.0x1.0mm(除了64GB 为11.5x13.0x1.4mm),皆采用FBGA封装153 ball。