【產品特性】• Micron®e·MMC and (LPDDR2/LPDDR3) components
• MLC NAND Flash in e·MMC
• RoHS-compliant, “green” package
• Separate e·MMC and LPDDR2 interfaces
• Space-saving multichip package
• Low-voltage operation VDD (1.70–1.95V)
• Dual voltage VCCQM (1.70–1.95V, 2.7–3.6V)
• Wireless temperature range: –25°C to +85°C
【文字介紹】Micron MCP products combine e·MMC and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members of the Micron discrete memory products portfolio.
The e·MMC and Mobile LPDRAM devices are packaged with separate interfaces (no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate e·MMC and Mobile LPDRAM buses.
The e·MMC and Mobile LPDRAM devices have separate core power connections and share a common ground (that is, VSS is tied together on the two devices).