代理產線

ESD108-B1-CSP0201

 2014-12-10

【基本資料】

【產品特性】

• ESD / transient protection of high speed data lines exceeding
– IEC61000-4-2 (ESD): ±30 kV (air / contact)
• Maximum working voltage: VRWM = ±5.5 V
• Ultra low capacitance CL = 0.28 pF (typ.) at f = 1 MHz
• Very low clamping voltage: VCL = 20 V (typ.) at ITLP = 16 A according to TLP
[1]
• Very low dynamic resistance: RDYN = 0.76 Ω (typ.)
• Minimized overshoot due to extremely low parasitic inductance of chip scale
package
• Miniature form factor (XY) = 0201 (0.58 mm x 0.28 mm)
• Thin 0.15 mm package thickness to allow direct integration into modules
• Optimized assembly: its bidirectional and symmetric I/V characteristics allow placement on the PCB with no danger of polarity orientation issues

【產品應用】

• USB 3.0, Firewire, DVI, HDMI, S-ATA, DisplayPort, Thunderbolt
• Mobile HDMI Link, MDDI, MIPI, SWP / NFC
• Dedicated solution to boost space saving and high performance in miniaturized modern electronics