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富威推出Invensense智能手机OIS模块解决方案

 2014-12-10

【方案介绍】
Invensense IDG-2030(U)为两轴陀螺仪组件,专为智能型手机OIS模块设计,提供防手震并增加照片清晰程度。


手机相机模块已成为今日掌上型产品的基本功能之一。这些模块,已演变到超越5 Mega Pixel(MP)的高分辨率与高影像质量。 观看最近的市场趋势,智能手机制造商正采用超过8 MP与具高分辨率的手机相机模块。对高分辨率的青睐,延伸出市场对光学防手抖功能的需求,以防止低光线下的手抖(hand jitter)与各种光线下的摄影抖动(video jitter)所导致影像扭曲的现象产生。相机模块整合与促动器技术(actuator technology)的发达,搭配InvenSense小尺寸、高效能的陀螺仪,让掌上型相机模块能够直接拥有OIS功能,提供不输DSC的影像质量。

 

富威代理产线InvenSense的新一代OIS专用二轴陀螺仪,是专门为了满足智能手机市场对相机的需求设计的。IDG-2030(U)为OIS新一代二轴陀螺仪产品,为目前市场的最小尺寸(2.3*2.3*0.65),可整合至最薄、最紧凑的模块中,并支持超音波水洗, 大大提高模块厂良率, 是最适合整合至下一代更薄之智能手机内的产品。InvenSense单一结构陀螺仪设计,含单一驱动频率(single drive frequency)、高敏感度、高轴间隔绝、低相位延迟、低噪声、迅速的20MHz SPI接口,使Invensense的解决方案,可满足目前与下一代智能手机相机模块对OIS的需求。

 

【产品应用】
• Optical Image Stabilization for Digital Still Camera and Video Cameras
• Electronic Image Stabilization for video jitter compensation

 

【产品特性】
2.1 Sensors
• Monolithic angular rate sensor (gyros) integrated circuit
• Available in XY (IDG-2030) versions.
• Digital-output temperature sensor
• External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
• Factory calibrated scale factor
• High cross-axis isolation via proprietary MEMS design
• 10,000g shock tolerant

 

2.2 Digital Output
• Fast Mode (400kHz) I2C serial interface
• 1 MHz SPI serial interface for full read/write capability
• 20 MHz SPI to read gyro sensor & temp sensor data.
• 16-bit ADCs for digitizing sensor outputs
• User-programmable full-scale-range of ±31.25°/sec, ±62.5°/sec, ±125°/sec and ±250°/sec

 

2.3 Data Processing
• The total data set obtained by the device includes gyroscope data, temperature data, and the one bit external sync signal connected to the FSYNC pin.
• FIFO allows burst read, reduces serial bus traffic and saves power on the system processor.
• FIFO can be accessed through both I2C and SPI interfaces.
• Programmable interrupt
• Programmable low-pass filters

 

2.4 Clocking
• On-chip timing generator clock frequency ±1% drift over full temperature range

 

2.5 Power
• VDD supply voltage range of 1.71V to 3.6V
• Flexible VDDIO reference voltage allows for multiple I2C and SPI interface voltage levels
• Power consumption for two axes active: 2.9mA
• Sleep mode: 5μA
• Each axis can be individually powered down

 

2.6 Package
• 2.3x2.3x0.65mm footprint and maximum thickness 16-pin QFN plastic package
• MEMS structure hermetically sealed at wafer level
• RoHS and Green compliant

 

【产品方块图】

 

更多代理产线信息欢迎前往富威网站: http://www.rich-power.com.tw