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Renesas Technology to Release SH-MobileHD1 Application Processor for Mobile Phones That Is First in Industry to Offer Full HD Video Recording and Playback Support


Provides Full HD support with low power consumption and in a small package, contributing to more compact video and audio processing systems

Renesas Technology Corp. announced the SH-MobileHD1 application processor for mobile phones (product number: SH7370), the first in the industry to deliver Full High-Definition (1,920 × 1,080 pixels, abbreviated “Full HD”) video recording and playback support. Sample shipments will begin on April 23, 2009 in Japan.

The video processing unit of the SH-MobileHD1 delivers approximately six times the performance of comparable earlier products from Renesas Technology, enabling support for Full HD video on a single chip. In addition to the low power consumption essential for mobile phones, the new application
processor also features more robust multimedia functionality. It is available in a small package designed to facilitate more compact video and audio processing systems for mobile phones.

The main features of the SH-MobileHD1 are summarized below:


Full HD video processing on a single chip

Thanks to innovations such as those listed below, the SH-MobileHD1 is the industry’s first application processor for mobile phones to provide Full HD video processing. It supports the H.264/MPEG-4 AVC*1 video compression standard (H.264) at Full HD video resolution with a recording/playback frame rate of 30 frames per second (fps).

  • Maximum operating frequency of 500 MHz, approximately twice as fast as comparable earlier Renesas Technology products
  • Video processing unit (VPU) delivering approximately six times the performance of comparable earlier Renesas Technology products
  • Video input interface for camera module conforming to Mobile Industry Processor Interface (MIPI) CSI-2 standard
  • Improved internal bus architecture

In addition, current consumption is reduced through measures such as enhanced internal power supply control, enabling realization on mobile phones of video applications comparable to those of digital home electronics such as LCD TVs.


Dedicated audio DSPs for reduced power consumption

The SH-MobileHD1 incorporates two 24-bit dedicated audio DSPs to lighten the audio processing load on the CPU and reduce power consumption. This enables one DSP to handle (stereo) audio processing such as the AAC (Advanced Audio Coding) high-quality audio compression standard and Dolby Digital codec, with power to spare, while the other DSP handles sonic enhancement such as equalization and sample rate conversion (SRC). In addition, heavy-load processing tasks
such as 5.1-channel audio can be assigned to the dual DSPs. Support for Dolby Digital and 5.1-channel audio allow interoperation with applications designed for consumer audio components.


Improved interoperation with digital home electronics and networks

The SH-MobileHD1 includes an interface that supports connection to a transmitter microchip that implements the HDMI high-speed multimedia interface used for interconnections between AV components. This allows connection and output of Full HD resolution video to digital home electronics components such as LCD TVs or Blu-ray Disc recorders.

In addition, the SHMobileHD1 can connect to an SD memory card and wireless LAN (WLAN) module, and it supports multiplexing*2 of the MPEG2-TS (transport system) and MP4*3 formats. Since MPEG2-TS is rapidly gaining popularity as a multiplexing format for HD and Full HD video in the digital home electronics field, support by the SH-MobileHD1 enables easy sharing of content between digital home electronics products and mobile phones. When content is stored as MP4 files, it can be shared easily over a network such as a WLAN. This helps increase the usability of video applications.


Small package
The SH-MobileHD1 supports Full HD video but uses a compact 407-pin BGA package measuring 10 mm × 11 mm. The application processor and 512 megabits of synchronous DRAM (SDRAM) are integrated into a single package as a system-in-package (SiP) device for greater system compactness.