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Laird - Thermally Enhanced Board Level Shields

 2013-10-15

【产品特性】

13.66x12.1x2.54mm   to 44.02x30.50x3.0mm shielding case with 0.5/1.0mm thick 3W thermal gap pad
Enhance   customer assembly process - from place CPU on baord, stick thermal pad on CPU   surface (manually), place shielding case to place CPU, place shielding case   (as thermal pad already adhesive on shielding case)

【产品应用】

Smart phone RF   module, GPU module

【文字介绍】

Laird   pre-assembly thermal pad on shielding case as a Thermal and EMI combine   component